wafer

wafer什么意思,wafer翻译

基本解释

n.: 薄片；威化饼；圣饼；圣体
v.: 用胶纸封
网络: 晶圆；晶片；圆片

权威解释

• 威化饼，薄脆饼（常与冰淇淋同吃）:

  a thin crisp light biscuit/cookie, often eaten with ice cream

• 圣饼；圣体；面饼:

  a very thin round piece of special bread given by the priest during Communion

• 薄片:

  a very thin piece of sth

英汉解释

• 用胶纸封

• 【宗教】圣饼〔一种供圣餐用的未发酵圆面包皮〕

• 薄脆饼;薄饼一样的东西;【物、无】圆片;薄片;晶片;【医学】糯米纸〔包药用的干糊片〕

• 垫板

• (封信用的)胶纸

• 薄酥饼

• 饼式试样

• 衬片

• 垫片

• 封信用之干胶片

• 薄脆饼;圆片糖

词性分析

• 复数：wafers

• 过去分词：wafered

• 现在分词：wafering

例句

• The invention relates to a radiator fan, which comprises a fan frame, an inner rotor motor, at least an impeller and a circuit wafer.

  一种散热风扇，其包含一个扇框、一个内转子马达、至少一个叶轮及一个电路板。

• Virgin Test Wafer- A wafer that has not been used in manufacturing or other processes.

  原始测试晶圆片-还没有用于生产或其他流程中的晶圆片。

• And a Y-type waveguide coupler on silicon-on-insulator(SOI)wafer used for an Intergrated optoelectronic Model was designed.

  设计了一种Y型SOI波导耦合器，用于光纤陀螺光收发模块。

• The sub-threshold current test, which is often done at the wafer level, is a measure of how quickly the device will turn on and off.

  亚阈区电流测试常常在晶圆片级进行。它是表示器件打开和关闭的快慢程度的参数。

• A small disk or wafer of wax, lead, or paper bearing such an imprint and affixed to a document to prove authenticity or to secure it.

  封缄上有印章的圆形的小蜡片、铅片或纸片，附在文件后用来证明权威或保证文件的安全。

• Egyptian priests practiced "transubstantiation" , claiming to be able to transfer the sun god Osiris into a circular wafer.

  古埃及祭司也有“圣餐仪式”，他们声称能够把太阳神奥西里斯转化到一个圆形的薄饼里。

• I went into a clean room with a fresh silicon wafer, and then I just cranked away at all the big machines for about 100 hours.

  我在无菌室操作一片硅晶片，接着我周转于所有这些大型机器中大约100个小时。

• The great game of short-term borrowing, used to purchase longer-term and risky assets, on wafer-thin equity, would be ruled out.

  凭借微薄的股本借入短期资金用于购买较长期限高风险资产的游戏将不复存在。

• Chip: The individual circuit or component of a silicon wafer, the leadless form of an electronic component.

  芯片：单回路或元件的硅晶元，无引脚的电子元件。

• The method for forming a solder mold for transferring solder to a wafer includes etching a plurality of solder cavities into a substrate.

  一种用于形成用于将焊料转移到晶片的焊料模的方法包括将多个焊料腔蚀刻到基板中。